According to SEMI market reports, foundry and DRAM are the two sectors of capital equipment investment in Taiwan, with OSATs’ advance packaging facilities as a key growth driver. Fab equipment spending in Taiwan is projected to be about $10.5 billion in 2015, approaching 30 percent of the overall industry spending on fab equipment. Overall, Taiwan represents 21 percent of the installed fab capacity globally and 25 percent of the installed 300mm capacity.

In 2015 alone, companies in Taiwan are forecast to spend $1.5 billion or more on packaging and test equipment. With the growing importance of packaging and testing, SEMI will host the Silicon in Packaging (SiP) Global Summit 2015 from September 3-4. The two-day SiP Global Summit 2015 consists of two major forums: 3D-IC Technology Forum and Embedded and Wafer Level Package Technology Forum.

SEMICON Taiwan covers a wide array of critical issues. Business programs will include the Executive Summit, Market Trends Forum, CFO Executive Summit, and Memory Executive Summit. Technology programs include: Materials Forum, Sustainable Manufacturing Forum, Advanced Packaging Technology Symposium, TechXPOTs, MEMS Forum, High-Tech Facility International Forum, eMDC Forum, Patterning Challenges (Cost vs. Performance), IC Design Summit, and more.

SEMICON Taiwan also features: Supplier Search Program and Buyers Briefing. As always, the event features a Leadership Gala dinner, an elite networking event and one of the most important annual executive gatherings for the high-tech industry in Taiwan.