Advanced Semiconductor Engineering, Inc. (ASE) today announced it has received the 2016 Asia Responsible Entrepreneurshi...
TAIPEI, Taiwan - Advanced Semiconductor Engineering(ASE) today announced that it will showcase System-in-Package (SiP) a...
‘The increasing number of electronic functions in an automotive vehicle has added to the complexity in automotive manufacturing. Such complexity also adds to the increased need for the IC assembly manufacturing process to adhere to strict automotive benchmarks and practices in order to achieve zero ppm in automotive testing. Zero ppm creates a mindset that strives to guarantee quality and reliability to ensure that vehicles are safe and dependable,’ says TS Chen, President of ASE Chung Li.
The ASE Chung Li site has been in the forefront of automotive IC assembly and testing, providing many of the industry’s top tier automotive device players with packaging solutions for almost two decades. The facility is also TS 16949 certified and continues to improve its quality and safety standards by undertaking global certification programs. The ISO 26262 certification will greatly benefit customers and ASE as both parties would be able to shorten the time needed to verify the functional safety of all products and enable customers to reach their intended markets quickly.
Heterogeneous integrated package solutions such as ASE’s System-in-Package, MEMS and sensor module solutions are robust technologies developed for the myriad and sophisticated electronics that make automotive vehicles smarter and safer.
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