Toshiba Corporation today announced the development of its next-generation SCiB, which uses a new material to double the capacity of the battery anode...
Toshiba Electronic Devices & Storage Corporation today announced the launch of “TCK401G” (active-high) and “TCK402G” (active-low)...
Production at Fab 6 will be entirely devoted to BiCS FLASH, Toshiba's innovative 3D Flash memory. As Toshiba announced in its August 3, 2017 release “Update on Toshiba Memory Corporation’s Investment in Production Equipment for Fab 6 at Yokkaichi Operations”, TMC has previously invested approximately 195 billion yen in Fab 6 as its first investment covering the installation of manufacturing equipment in the Phase-1 clean room and the construction of the Phase-2 clean room.
Demand for TMC’s next generation 3D Flash memory devices is expected to increase significantly due to growing demand for enterprise SSDs in datacenters, SSDs for PCs, and memory for smartphones; TMC expects this strong market growth to continue in 2018. TMC’s investment timing will position it to capture this growth and expand its business.
The investment in Fab 6 will enable TMC to install manufacturing equipment for 96-layer 3D Flash memories, including deposition and etching equipment.
TMC has recently asked SanDisk, its collaborator in three joint ventures for investment in manufacturing equipment at TMC’s Yokkaichi Operations, whether it intends to jointly participate in this second investment for the Phase-1 clean room in the Fab 6 facility.
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