Peratech, a force-sensing technology provider, has been selected to participate in the Innovation Zone (I-Zone) at SID Display Week 2017...
Peratech and Humax have co-developed a 3D force touch remote control that utilises Peratech’s unique Quantum Tunnelling Composite (QTC) sensor technology...
The solution can be used to create flexible displays that incorporate multi-point force-touch sensing of arbitrary size, from wearable devices to large displays. The surface of the sensing display is flexible, allowing it to curve and conform to the shape of the end application, such as a wristband, dashboard or other work surface.
“This is a significant technological milestone for us,” said Jon Stark, Peratech CEO. “No other flexible active-matrix 3D touch sensor with integrated display is available on the market today. Our collaboration with Merck and FlexEnable has created a new enabling solution for human-machine interfaces to address existing demand.”
The integrated solution is based on FlexEnable’s low-temperature organic thin-film transistor (OTFT) fabrication expertise using Merck lisicon OTFT material technology together with Merck licristal liquid crystal materials. All of the circuitry that drives the organic LCD is integrated alongside the 3D touch sensing elements, making display and force touch a single component in terms of design and system integration. This application will be introduced at LOPEC 2018 in Munich, Germany.
The result is a high-resolution force-sensing display. The force sensor provides a raw spatial resolution of 25ppi using 100 by 64 active-matrix sensing elements for the 3D touch sensor. The elements, or sensels, detect both location of touch points and the amount of force applied to each sensel in the contact area, making the theoretical interpolated resolution greater than 10,000 ppi with standard ICs typically used in consumer, automotive, and industrial electronics.
CTIMES loves to interact with the global technology related companies and individuals, you can deliver your products information or share industrial intelligence. Please email us to email@example.com
- 1Mobile DRAM Revenues Grow Slower in 1Q18, Says TrendForce
- 2Hon Hai to Develop Big Data, AI, and the IIoT in the Next Three Years
- 3MediaTek Joins ONNX Along with Facebook, Microsoft and Amazon to Promote AI Technologies
- 4ASE and TDK Establish Joint Venture to Provide Wearable Chip Package Solutions
- 5Intel Introduces ‘Intel AI: In Production’ Program with AAEON