TAIPEI, Taiwan - The 3GPP standard conference will be held in Taipei, Taiwan, next week. To foster the local 5G supply chain in Taiwan...
MediaTek announced its newest intelligent connectivity chipset to support the next generation of Wi-Fi technology - Wi-Fi 6 (802...
The MediaTek Helio M70 is a multimode chipset with 2G/3G/4G/5G-enabled support. It supports 5G radio (NR), along with the standalone (SA) and non-standalone (NSA) network architectures, the sub-6GHz frequency band, high power user equipment (HPUE), and other key 5G technologies. It’s designed in compliance with the 3GPP Rel-15 new specifications with 5 Gbps data rate, leading the industry to support carrier aggregation.
Delivering an improved experience for customers and end users, the MediaTek Helio M70 baseband chipset supports LTE and 5G dual connectivity (EN-DC) while also ensuring that mobile devices are backward compatible with 4G/3G/2G in the absence of 5G networks. Thanks to its multi-mode solution, the Helio M70 simplifies the design of 5G devices with a comprehensive power management plan, enabling device makers to design mobile devices with a smaller form factor, improved energy-efficiency and competitive appearance.
Partnering closely with China Mobile in 5G development, MediaTek supports not only in 5G standards development and testing, but also in building an industry ecosystem, helping global operators achieve their 5G network roadmap goals in 2019.
“MediaTek is committed to promoting the adoption of the latest technologies. With the commercialization of the first 5G baseband chipset, Helio M70, consumers will be able to enjoy the exciting 5G experience from a mature and complete solution,” said TL Lee, general manager of MediaTek Wireless Communications Division. “In the future, 5G and AI application areas will continue to grow, enhancing the connected experience for users in areas such as mobile phones or smart living.”
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