The 2920 Series broadband plasma patterned wafer, Puma 9850 laser scanning patterned wafer, and Surfscan SP5 unpatterned wafer defect inspection systems deliver enhanced sensitivity and significant throughput gains. Each of the inspection systems seamlessly connects with the eDR-7110 electronbeam review system, which utilizes improved automatic defect classification capability to quickly identify detected defects, providing chipmakers with accurate information for determining corrective action.

Utilizing a third-generation broadband plasma illumination source, the 2920 Series patterned wafer defect inspection platform delivers twice the light of its predecessor, enabling the use of a new deep ultra violet (DUV) wavelength band and the industry's

smallest optical inspection pixel. Also, 2920 Series' novel Accu-ray and Flex Aperture technologies can quickly determine the best optical settings for capture of critical defect types, significantly reducing the time required to discover and solve process and design issues.

The Puma 9850 laser scanning patterned wafer defect inspection system provides improved sensitivity across a range of production throughputs to support a diverse array of FinFET and advanced memory inspection applications. Complementing the 2920 Series inspectors, the Puma 9850's higher sensitivity operating modes facilitate yield-relevant defect capture on after-develop inspection (ADI), photo-cell monitor (PCM), and front-end-of-line linespace etch layers.

Surfscan SP5 unpatterned wafer inspector incorporates enhanced DUV optical technologies that produce sub-20nm

defect sensitivity at production throughput, enabling detection of tiny substrate or blanket film defects that can inhibit successful integration of multi-stack IC devices.

The eDR-7110 e-beam review system includes a new SEM Automatic Defect Classification (S-ADC) engine that can produce an accurate representation of the defect population during production and can be used during development to dramatically reduce the time required for defect discovery.