TI's TPS546C23 power converter integrates high- and low-side MOSFETs into a small-footprint package that is significantly denser than competitive devices. Designers can stack two converters in parallel to drive loads up to 70 A for processors in space-constrained and power-dense applications in various markets, including wired and wireless communications, enterprise and cloud computing, and data storage systems.

The highly integrated TPS546C23 power converter is 44-percent denser (amperes per square millimeter) than competitive devices. It features 0.5 percent reference-voltage accuracy over temperature and full differential remote-voltage sensing to meet the voltage accuracy requirements of deep sub-micron processors.

Current sharing enables the stacking of two converters and high efficiency and excellent thermal performance are delivered via the device's single-pad, stacked die, quad flat no-lead (QFN) package. Read the blog post, "Stack current with PowerStack packages for higher POL."

TI also offers the TPS546C20A PMBus converter that supports pin-strapping for both the output voltage and soft-start time.