Nordic Semiconductor today announces the launch of its Bluetooth 5 ready nRF52840 SoC with features and capabilities tha...
Nordic Semiconductor today announces the availability of its ‘Power Profiler Kit’, a development tool comprising PC-...
The module employs the 3 by 3.2mm wafer-level chip scale package (WL-CSP) variant of Nordic’s nRF52832 SoC, which alongside MtM’s System-in-Package (SiP) technology results in a 6.5 by 6.5mm form factor and makes the module suitable for a wide range of space-constrained, low power applications, for example wearables or standalone devices offering voice control, pattern recognition, or environmental learning functionality.
The M905 allows product manufacturers to speed up development, production, and time-to-market of demanding Bluetooth 4.2-enabled applications, without the customer requiring any RF design expertise. The module includes an integrated antenna, along with a full range of programmable on-chip analog and digital peripherals.
Nordic’s nRF52832 Bluetooth low energy SoC, a member of Nordic’s sixth generation of ultra low power (ULP) wireless connectivity solutions enables the module to power even the most complex, processor-intensive wireless applications.,
“The nRF52832 SoC was a natural choice for us,” says Cedric Lam, MtM Technology Corporation, Chief Technology Officer. “The tiny WL-CSP is the smallest package on the market which includes such a powerful processor and rich I/O support. Moreover, power consumption—which is crucial to our customers—is among the lowest in the market. And the integrated NFC-A tag for easy pairing reinforced our decision.
“Our experience both in terms of technical and business support is a key reason why we continue to work with Nordic.”
The M905 will also be available as a Development Kit board, allowing the module to be interfaced with MtM’s existing range of sensor boards.