Technology Front
Toshiba Expands New Packaging Option for SO6L IC-Output Photocouplers
Published: Mar 22,20181291 Read
Toshiba Electronic Devices & Storage Corporation is expanding its line-up of SO6L IC-output photocouplers with a new wide leadform package type SO6L(LF4). Shipments start today.
Toshiba Releases 650V Super Junction Power MOSFETs in TOLL Package
Toshiba has launched 650V super junction power MOSFETs, TK065U65Z, TK090U65Z, TK110U65Z, TK155U65Z and TK190U65Z, in its...
Toshiba Launches 100V High-Current Photorelay for Industrial Equipment
Toshiba has launched "TLP241B," a high-current photorelay in a DIP4 package for industrial equipment such as programmable logic controllers and I/O interfaces...
The SO6L(LF4) package has a creepage distance of 8mm, which meets the industry’s standard creepage distance for SO6L.
To date, Toshiba has offered eight photocouplers in the SO6L(LF4) package: three for high-speed communication applications and five for IGBT/MOSFET drive applications. Now the company has added six photocouplers in the SO6L(LF4) package to its product portfolio: three for high-speed communication applications and three for IGBT/MOSFET drive applications.
The SO6L(LF4) package is footprint-compatible with the SDIP6(F type) package with wide lead-forming option and a maximum package height of 4.15mm. In addition, the SO6L(LF4) package has a maximum height of 2.3mm, which is approximately 45% thinner than the conventional SDIP6(F type) package. Its low profile package contributes to system size reduction and can be mounted in height-restricted locations, such as the back of a board.
Toshiba will release more IC-output photocouplers as direct replacements for the current SDIP6 (F type) package.
Top Stories
Most Popular
Related Products
Address: 11F.-3, No.29, Sec. 3, Zhongshan N. Rd., Zhongshan Dist., Taipei City 104, Taiwan (R.O.C.)
Phone:+886 2 2585-5526
E-Mail:en@ctimes.com.tw