STMicroelectronics announced it has signed an agreement to acquire a majority stake in Swedish silicon carbide (SiC) wafer manufacturer Norstel AB ("Norstel")...
Cree announces that it signed a multi-year agreement to produce and supply its Wolfspeed silicon carbide (SiC) wafers to STMicroelectronics...
Containing a 3-axis accelerometer and a 3-axis gyroscope with user-selectable full-scale up to ±16g and ±2000dps respectively, the ISM330DLC provides high measurement resolution and smart energy-saving features to enable long-lasting battery-powered industrial devices. Ideal for applications such as industrial IoT systems, robots, drones, platform stabilizers, and telematics, its wide accelerometer bandwidth up to 3kHz also allows use in vibration-monitoring and compensation systems.
The ISM330DLC consumes just 0.5mA in normal combination mode and 0.75mA in high-performance mode. In addition, with a large integrated FIFO that lets the host system retrieve data efficiently, as well as smart features and interrupts including tilt detection, free-fall, wakeup, 6D/4D orientation, click, and double-click, the ISM330DLC enables power-conscious application design to achieve additional energy savings. There is also a sensor-hub feature for efficiently collecting data from additional external sensors.
Extensive industrial-grade design features are built-in, including a dedicated configurable low-latency signal-processing path, low noise, and filtering optimized to ensure closed-loop control stability. The signal path can be independently configured to make gyroscope or accelerometer data available through an auxiliary SPI interface.
As a richly featured device architected for high accuracy, stability, and reliability, the ISM330DLC also contains a temperature sensor and built-in self-test both for the gyroscope and accelerometer.
The ISM330DLC is in production now, as a 2.5mm x 3mm x 0.83mm plastic land-grid array (LGA) system-in-package.
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