? Toshiba Memory Unveils Industry's First UFS Ver. 3.0 Embedded Flash Memory Devices
 
Taipei, Wednesday, Apr 24, 2019, 06:14

Technology Front

Toshiba Memory Unveils Industry's First UFS Ver. 3.0 Embedded Flash Memory Devices

Published: Jan 23,2019

214 Read

Toshiba Memory Corporation has started sampling the industry’s first Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. The new line-up utilizes the company’s cutting-edge, 96-layer BiCS FLASH 3D flash memory and is available in three capacities: 128GB, 256GB and 512GB. With high-speed read/write performance and low power consumption, the new devices are suitable for applications such as mobile devices, smartphones, tablets, and augmented/virtual reality systems.

More on This

Toshiba Launches Sensorless Control Pre-Driver IC for Automotive BLDC Motors

Toshiba announced the launch of a sensorless control pre-driver IC “TB9062FNG” for brushless DC motors (BLDC motors) used in automotive applications...

Toshiba Adds BiCS FLASH Enabled UFS to Lineup of Embedded Flash Memory for Automotive

Toshiba Memory Corporation announced that it has begun sampling new Automotive JEDEC UFS Version 2.1 embedded memory solutions utilizing 3D flash memory...

The new devices integrate 96-layer BiCS FLASH 3D flash memory and a controller in a JEDEC-standard 11.5 x 13.0mm package. The controller performs error correction, wear leveling, logical-to-physical address translation and bad-block management for simplified system development.

All three devices are compliant with JEDEC UFS Ver. 3.0, including HS-GEAR4, which has a theoretical interface speed of up to 11.6Gbps per lane (x2 lanes = 23.2Gbps) while also supporting features that suppress increases in power consumption. Sequential read and write performance of the 512GB device are improved by approximately 70 percent and 80 percent, respectively, over previous generation devices.

comments powered by Disqus