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NXP and Freescale Announce Completion of Merger

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Published: Dec 08,2015

 

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Imec Advances Drive Current in Vertical 3D NAND Memory Devices

At IEEE IEDM conference, imec showed for the first time the integration of high mobility InGaAs as a channel material for 3D vertical NAND memory devices formed in the plug (holes) with the diameter down to 45nm. The new channel material improves transconductance (gm) and read current which is crucial to enable further VNAND cost reduction by adding additional layers in 3D vertical architecture...

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SEMI Reports Q3 Semiconductor Equipment Figures; Billings $9.6 Billion

SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$9.6 billion in the third quarter of 2015. The billings figure is 3 percent higher than the second quarter of 2015 and 9 percent higher than the same quarter a year ago...

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ITRI Proposal Selected as a Google Solve for X “Moonshot”

TAIPEI, Taiwan — On the opening day of the UN climate change summit COP21 in Paris, Microsoft Co-Founder Bill Gates announced a multi-billion dollar clean energy initiative to save the world from global warming. The largest high-tech applied research institution in Taiwan, Industrial Technology Research Institute (ITRI) shares the same determination to boost low-carbon innovation...

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iPhone Assembly Manufacturer Competition Between Pegatron and Foxconn is in the White-Hot Stage

TAIPEI, Taiwan — iPhone assembly manufacturer competition between Pegatron and Foxconn is in the white-hot stage, it is widely circulated that Pegatron is going to close its iPad mini manufacturing assembly line in a bid to assemble more iPhone...

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Asus’ Market Share Dramatically Rises in Malaysian Mobile Market

TAIPEI, Taiwan - According to an Economic Daily News report, the Asus Zoom went on sale in Singapore, Hong, Kong, and Malaysia. Because of Asus’ rapid sales growth in Malaysia, local telecommunications companies have begun collaborating with Asus, which will help Asus’ market share to rise next year in the Malaysian market...

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Imec, Coventor Expand Collaboration to Optimize 7 nm Processes

Imec and Coventor today announced the expansion of a joint development project to explore process variation issues in 7nm semiconductor technology. For over a year, the joint team has been using Coventor’s semiconductor process modeling platform, SEMulator3D, to perform predictive modeling of semiconductor fabrication processes and to proactively analyze process variation issues in 7nm semiconductor technology...

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