ITRC Debuting at SEMICON Taiwan 2014 Showcasing Core Tech
TAIPEI, Taiwan — Instrument Technology Research Center (ITRC) made debut at SEMICON Taiwan 2014, showcasing core technologies includes precision optical mechanical system design, precision optical component fabrication, precision optical blooming, and precision mechanical packaging and inspection...
Q3 LED Lighting Demand flat, Market Sees Intense Price Competition
TAIPEI, Taiwan－ According to LEDinside, in the third quarter, LED market activity typically slows, LED backlighting prices declined an average of 3-8% as demand fell. Meanwhile, LED demand for lighting applications remained flat, but price competition in the overall LED market, remained fierce, as prices fell 6-12%...
Ovum: M2M Market to Reach US$66B By 2019
The latest forecast from the world’s largest telecom analyst firm projects that the cellular M2M market will bring in a total of US$252bn for the 2015–19 period, presenting an attractive revenue opportunity for operators that choose to invest in their existing capabilities...
Interests in Wearables and IoT Boost APAC Governments' Mobility Competencies
Wearable technologies will boost Smart Mobile Government (Smart mGovt) projects and consequently, pave the way for public sector Internet of Things (IoT) ecosystems, says IDC Government Insights. An IDC Government Insights report...
SEMICON Taiwan 2014 to Showcase the Next 3 big Things
TAIPEI, Taiwan — SEMICON Taiwan 2014 will be the highlight of semicondoctor industry this week, which is going to be held at Nangang Exhibition Hall from September 3 to 5. John Wei, Sr. Director at Mobile & Computing BD of TSMC said in the SEMICON Taiwan 2014 press conference that there will be three hot topics of semiconductor industry, including ultra-low power, sensor technology optimization, and advanced packaging...
Moldex3D to Roll out new IC Packaging Solutions at SEMICON Taiwan 2014
Moldex3 to Roll out new IC Packaging Simulation Solutions TAIPEI, Taiwan — CoreTech System (Moldex3D) will exhibit the newest suite of simulation solutions for IC Packaging at SEMICON Taiwan 2014, which includes 2.5D to 3D IC stacking underfill process that can fulfill the needs of both designing and manufacturing fields...
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