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Technology front

Broadcom Delivers New Trident 3 Generation of 10/25/100G Ethernet Switches

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Published: Jun 15,2017

 

Microchip Extends eXtreme Low Power PIC32MM MCU Family

New PIC32MM “GPM” microcontrollers (MCUs) are now available from Microchip Technology. The eXtreme Low Power (XLP) devices feature large memory in small packages, providing ample battery life for space-constrained applications...

Marvell Introduces Industry's First Wi-Fi, Bluetooth 5 and 802.11p Combo Solutions for V2X and IVI

Marvell announced the 88W8987xA, the world's first automotive-grade system-on-chip (SoC) to integrate the latest Wi-Fi, Bluetooth, and vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) capabilities. This highly sophisticated wireless combo chip brings an industry-best solution for in-car Wi-Fi, Bluetooth 5 and 802...

Keysight Technologies’ New 5G Test Solution

Keysight Technologies announced a solution for measuring, analyzing and visualizing the coverage generated by 5G base stations. Keysight’s Nemo Outdoor, combined with FieldFox handheld RF and microwave analyzers, enables mobile operators and network vendors to measure 5G radio propagation and coverage...

Toshiba Launches New Series of 15,000 RPM Enterprise 2.5-inch HDD

Toshiba Corporation's Storage & Electronic Devices Solutions Company today announced the launch of AL14SX Series, new additions to its line-up of enterprise performance hard disk drives (HDD) for mission critical server and storage applications...

ADLINK’s MVP-5000 Fanless Embedded Computers with 6th Gen Intel Core CPU

ADLINK Technology has announced the release of the MVP-5000 series, the newest member of ADLINK’s value family of fanless embedded computing platforms. The MVP-5000 series provides an optimal balance of price and performance in a compact construction...

Alliance Memory Introduces New Die Version for 2Gb and 4Gb DDR3 and DDR3L SDRAMs

To address the memory market's shortage of high-speed CMOS DDR3 and low-voltage DDR3L SDRAMs, Alliance Memory today announced a new die revision (B die) for its 2Gb and 4Gb devices in the 96-ball FBGA package. "Market demand for DDR3 and DDR3L SDRAMs is extremely high due to their increased functionality and speed...

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