Technology front
u-blox’s Latest Meter-level Positioning Technology Offers Enhanced GNSS Performance
By
Published: Oct 31,2019
Würth Elektronik Introduces WSEN-PADS Absolute Pressure Sensor
Würth Elektronik presents a very compact MEMS-based (Micro-Electro-Mechanical Systems) absolute pressure sensor: The 2.0 x 2.0 x 0.8 mm sized WSEN-PADS measures pressure in the range between 26 and 126 kPa. Its output data rate can be selected between 1 and 200 Hz...
STMicroelectronics Updates TouchGFX Suite to Elevate UI and Reduce Memory and CPU Needs in STM32 MCU
STMicroelectronics has updated the TouchGFX user-interface software framework for STM32 microcontrollers, adding new features that enable smoother and more dynamic user interfaces and lower demand on the memory and CPU. TouchGFX is a free tool in the STM32 ecosystem...
Toshiba’s New Three-Phase Brushless Motor Control Pre-Driver IC
Toshiba today announced “TC78B027FTG,” a three-phase brushless motor control pre-driver IC with Intelligent Phase Control (InPAC) technology that enables optimum operating efficiency in applications such as high-velocity server fans, blowers and pumps...
Flexible 12-channel Automotive LED Driver from STMicroelectronics
The STMicroelectronics ALED1262ZT 12-channel LED driver targets advanced automotive rear combination lamps and interior lighting, bringing features to support complex and innovative visual effects. Independent 7-bit PWM dimming on all channels allows flexible control of tail, stop, and indicator lights, with dynamic effects...
The VPC-3350S: Mobile, Flexible and Customizable
AAEON announced the VPC-3350S, its latest mobile NVR system. Featuring the Intel Processors formerly Apollo Lake, four PoE ports, and an innovative modular design, the VPC-3350S provides customers a system that is flexible, customizable, and budget friendly...
DELO Introduces Compact LED Curing Lamp DELOLUX 503
DELO has developed a particularly space-saving UV lamp for adhesive curing. The powerful DELOLUX 503 is designed for industrial applications requiring small surfaces to be bonded within seconds in serial production lines, for example for bonding cameras used in autonomous cars...
Top Stories
Most Popular
- 1STM Reveals New Antenna-matching RF Integrated Passive Devices for STM32WL MCUs
- 2HOLTEK HT32 Series Conforms to the UL/IEC 60730-1 Class B Software Security Certification
- 3u-blox’s Newest Module Stands Temperatures up to 105 °C for Advanced Automotive Applications
- 4u-blox Extends Reach of Secure LTE-M, NB-IoT Module with 400MHz Support
- 5Toshiba Launches 100V High-Current Photorelay for Industrial Equipment
- 6u-blox Introduces the Smallest LTE-M/NB-IoT Module with 23dBm RF Output Power
- 7DKSH Partners with Life Science Innovator Nicoya in Asia
- 8VIAVI First to Introduce RedCap Device Emulation, Boosting 5G IoT Commercialization
- 9HOLTEK New BP66FW1242 Wireless Charger Rx MCU
- 10World’s Smallest Plug-and-play NFC Security Module
Address: Rm. A204, No. 287-2, Sec. 3, Chengde Rd., Datong Dist., Taipei City , Taiwan (R.O.C.)
Phone:+886 2 2585-5526
E-Mail:en@ctimes.com.tw