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Next Gen Re-Programmable 2-Wire Hall Effect Switches Simplify System Design Implementation

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Published: May 22,2014

 

New Integrated Solution for Rapid Die-Package Interconnect Planning

Cadence Design Systems announced a new integrated solution to significantly cut down die-package interconnect planning time from weeks to days by reducing iterations between silicon and package design teams. The solution, built on Cadence OrbitIO technology, also shortens the time to converge on the physical interface between the die and package up to 60 percent, all within the context of the full system...

New Low Voltage Power MOSFETs Reduce Losses to Meet Industry Demand for Greater Efficiency

ON Semiconductor has introduced a new family of six N-channel Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) that have been designed and optimized to deliver industry leading efficiency compared to existing devices on the market...

Smart Meter Design with Wireless M-Bus Software

Silicon Labs introduced a comprehensive software solution designed to simplify the development of wirelessly connected smart meters for electricity, gas, water and heat resources based on the proven Wireless M-Bus standard. Wireless connectivity provides scalable, easy-to-deploy communications technology for many smart metering applications...

Approaching Object Detection Library to Support Driver Safety

Fujitsu Semiconductor Limited announced that it has released the Approaching Object Detection Library, software for use with the company's graphics SoCs to visualize information from vehicle-mounted cameras to detect people, vehicles, and other objects nearby...

Next-generation Compact Design Mobile Dome Network Camera MD8531H

VIVOTEK announce tthe launch of its next-generation compact design 1.2MP mobile dome network camera, MD8531H, which is especially designed with several unique features ideal for transportation applications such as cars, trucks fleet, freight wagon, buses, trains, and other vehicles...

Highest Power and Frequency Plastic Packaged GaN Transistors for Low Cost Radar and Datalinks

Cree, Inc. introduces the industry’s highest power continuous wave (CW) GaN HEMT RF transistors packaged in a dual-flat no-leads (DFN) format. Aimed at the cost-sensitive sub-100W commercial radar and data link amplifier market segments...

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