Regional marketshares of IDMs (companies operating wafer fabs), fabless companies, and total IC sales were led by U.S. headquartered companies in 2019, according to data presented in the recently released March Update to The McClean Report 2020...

TAIPEI, Taiwan - Under long-term support from the “Taiwan Consortium of Emergent Crystalline Materials” (TCECM) program of the Ministry of Science and Technology (MOST), Taiwan, a research team at National Chiao Tung University (NCTU) collaborated with Taiwan Semiconductor Manufacturing Company (TSMC) to form an industry-university joint research team, reporting a breakthrough in the synthesis of one-atom-thick boron nitride (BN)...

This week, at the SPIE Advanced Lithography Conference, imec and ASML announce a breakthrough in printing narrow 24 nanometer (nm) pitch lines, corresponding to the dimensions of critical back-end-of-line metal layers of a 3 nm technology node process...

Samsung Electronics today announced that its new cutting-edge semiconductor fabrication line in Hwaseong, Korea, has begun mass production. The facility, V1, is Samsung’s first semiconductor production line dedicated to the extreme ultraviolet (EUV) lithography technology and produces chips using process node of 7 nanometer (nm) and below...

TAIPEI, Taiwan - According to WSTS, Q4 2019 worldwide semiconductor revenue reached US$108.3 billion, a year-to-year decrease of 5.5% and up 0.9% on-quarter. Sales quantity reached 237.2 billion ICs, a 4.0% decline on-year and down 1...

TAIPEI, Taiwan - Amid continued economic uncertainty and high inventory levels, growth of the worldwide IC packaging and testing industry is expected to slow down, and the worldwide IC packaging and testing industry shipment value is estimated to reached US$29...

The semiconductor business is defined by rapid technological changes and the need to maintain high levels of investment in research and development for new materials, innovative manufacturing processes for increasingly complex chip designs, and advanced IC packaging technologies...