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More IoTs Solutions

Telink Semiconductor’s RF SoC Passes ZigBee 3.0 Certification (2017.01.09)

Telink Semiconductor has announced that its ZigBee RF SoC has passed the ZigBee compliant platform tests based on the latest ZigBee stack specification using DSR Corporation’s ZBOSS 3.0 ZigBee 3.0 wireless stack, and thus can start to provide a ZigBee 3...

Ericsson, Qualcomm Complete China's First Data Call on the eMTC/Cat-M1 Standard for Cellular IoT (2016.12.30)

Ericsson and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, have completed China's first end-to-end data call using new cellular Internet of Things (IoT) eMTC/Cat-M1 technology. The test was achieved in the lab of the research division of China Mobile - China Mobile Research Institute (CMRI) - on November 11...

Trend Micro Team Up With ASUS in IoT Security (2016.12.29)

TAIPEI, Taiwan - Trend Micro Incorporated recently partnered with ASUS to protect home users against malicious IoT threats with Trend Micro Smart Home Network solution embedded in ASUS wireless home routers. “The home network is getting more complicated and dangerous than ever with more IoT devices showing up,” said Dr...

Ultra-compact DIN-rail IIoT Gateway with i.MX6UL Processor (2016.12.23)

Axiomtek is unveiling the IFB122, an extremely compact RISC-based DIN-rail industrial IoT gateway powered by the low-power Freescale i.MX6UL-2 processor in the ARM Cortex-A7 micro architecture. Designed to meet the challenges in critical environments, it supports extended operating temperature ranging from -40°C to 70°C, flexible wide voltage range 9V - 48V DC power input, and can withstand vibration up to 5G...

Taiwan Forms IoT Technology and Industry Association (2016.12.22)

TAIPEI, Taiwan - More than twenty Taiwanese companies and ten related associations together with research units on December 20 established Taiwan IoT Technology and Industry Association (TW.IOTA) to assist in the development of standards and specifications for Internet of Things related applications...

TDK to Acquire InvenSense (2016.12.21)

TDK Corporation and InvenSense, Inc. entered into a definitive agreement today wherein TDK agrees to acquire all of the outstanding InvenSense shares for cash at an acquisition price of USD 13.00 per InvenSense share, for a total acquisition price of USD 1...

STM and Valencell Announce Collaboration on Biometric Sensor Platform for Wearables and IoT (2016.12.21)

Valencell and STMicroelectronics (STM) announced today the launch of a new, highly accurate and scalable development kit for biometric wearables that includes ST's compact SensorTile turnkey multi-sensor module integrated with Valencell's Benchmark(TM) biometric sensor system...

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