Taipei, Saturday, Sep 26, 2020, 15:22

More ICs Solutions

TSMC and NCTU Work on Wafer-scale One-atom-thick Insulating Layer Technology (2020.03.17)

TAIPEI, Taiwan - Under long-term support from the “Taiwan Consortium of Emergent Crystalline Materials” (TCECM) program of the Ministry of Science and Technology (MOST), Taiwan, a research team at National Chiao Tung University (NCTU) collaborated with Taiwan Semiconductor Manufacturing Company (TSMC) to form an industry-university joint research team, reporting a breakthrough in the synthesis of one-atom-thick boron nitride (BN)...

Imec demonstrates 24nm pitch lines with single exposure EUV lithography on ASML’s NXE:3400B scanner (2020.02.27)

This week, at the SPIE Advanced Lithography Conference, imec and ASML announce a breakthrough in printing narrow 24 nanometer (nm) pitch lines, corresponding to the dimensions of critical back-end-of-line metal layers of a 3 nm technology node process...

Samsung Electronics Begins Mass Production at New EUV Manufacturing Line (2020.02.20)

Samsung Electronics today announced that its new cutting-edge semiconductor fabrication line in Hwaseong, Korea, has begun mass production. The facility, V1, is Samsung’s first semiconductor production line dedicated to the extreme ultraviolet (EUV) lithography technology and produces chips using process node of 7 nanometer (nm) and below...

TSIA Announces 2019 Statistics of Taiwan’s IC Industry (2020.02.17)

TAIPEI, Taiwan - According to WSTS, Q4 2019 worldwide semiconductor revenue reached US$108.3 billion, a year-to-year decrease of 5.5% and up 0.9% on-quarter. Sales quantity reached 237.2 billion ICs, a 4.0% decline on-year and down 1...

SiP and Heterogeneous Integration as Key Driving Force of Growth for IC Packaging and Testing (2020.02.03)

TAIPEI, Taiwan - Amid continued economic uncertainty and high inventory levels, growth of the worldwide IC packaging and testing industry is expected to slow down, and the worldwide IC packaging and testing industry shipment value is estimated to reached US$29...

Semiconductor R&D To Nudge Higher Through 2024 (2020.02.03)

The semiconductor business is defined by rapid technological changes and the need to maintain high levels of investment in research and development for new materials, innovative manufacturing processes for increasingly complex chip designs, and advanced IC packaging technologies...

eMemory and UMC Qualify NeoFuse IP on the Foundry’s 28nm High Voltage Process (2020.01.20)

HSINCHU, Taiwan – eMemory and United Microelectronics Corporation today announced that eMemory’s NeoFuse IP has been qualified on UMC’s 28nm High Voltage (HV) platform to target the fast-growing OLED market. Key customers have completed successful product tape outs using this IP and process, which are ready for mass production...

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