Taipei, Sunday, Sep 23, 2018, 02:46

More ICs Solutions

Integrated Circuit Technology Advances Continue to Amaze (2018.02.22)

The success and proliferation of integrated circuits has largely hinged on the ability of IC manufacturers to continue offering more performance and functionality for the money. Driving down the cost of ICs (on a per-function or per-performance basis) is inescapably tied to a growing arsenal of technologies and wafer-fab manufacturing disciplines as mainstream CMOS processes reach their theoretical, practical, and economic limits...

Imec Introduces CMOS Chip With 16,384 Micro-electrodes and 1,024 Channels (2018.02.13)

Imec has designed and fabricated a 16,384-electrode, 1,024-channel micro-electrode array (MEA) for high-throughput multi-modal cell interfacing. The chip offers intracellular and extracellular recording, voltage- and current-controlled stimulation, impedance monitoring and spectroscopy functionalities thereby packing the most cell-interfacing modalities on a single chip, and being the only one to enable multi-well assays...

Q4 2017 Taiwan IC Revenue Totaled NT$675.5 Billion, 4.9% Increase On-year (2018.02.13)

The TSIA survey showed that Q4 2017 Taiwan IC revenue as a whole (including design, manufacturing, packaging and testing) totaled NT$675.5 billion(US$22.2B) (up 5.1% on-quarter and 4.9% increase on-year). The revenue wad with NT$160...

ASML Increases its Dominance of Semiconductor Lithography Market in 2017 (2018.02.12)

ASML’s dominance in the semiconductor equipment market continued in 2017, according to the report “Sub-100nm Lithography: Market Analysis and Strategic Issues,” recently published by The Information Network, a New Tripoli, PA-based market research company...

Mobile System on Chip Designs, Embedded Processing Lift MPU Market (2018.02.02)

The recently released 2018 edition of IC Insights’ McClean Report shows that the fastest growing types of microprocessors in the last five years have been mobile system-on-chip (SoC) designs for tablets and data-handling cellphones and MPUs used in embedded-processing applications...

ASE and Cadence Deliver First System-in-Package EDA Solution (2018.02.01)

KAOHSIUNG, Taiwan - Advanced Semiconductor Engineering, Inc. and Cadence Design Systems today announced they have collaborated to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages...

Groundbreaking for TSMC 5nm Factory Estimated for 2020 (2018.01.29)

TAIPEI, Taiwan - TSMC on last Friday in Southern Taiwan Science Park held a groundbreaking ceremony for the first phase of construction on their Fab 18 factory with CEO Morris Chang personally presiding over the ceremony. Construction and installation are expected to be completed in the first quarter of 2019 with mass production commencing early in 2020...

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