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GUC and M31 Bundle USB 3.0 Solution
Published: Jan 03,2014[Hsinchu, Taiwan] Global Unichip Corp. (GUC), the Flexible ASIC LeaderTM, and M31 Technology, a global boutique Intellectual Property (IP) provider today unveiled a combination USB 3.0 IP that bundles GUC’s Peripheral Device Controller IP and M31 Technology’s PHY IP that is now available on 65/55nm, 40nm, and 28nm process technologies.
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This new solution has successfully passed compatibility test and gained certification at the USB-IF Compliance Workshop Taiwan held in November, 2013. It is ideal for mega storage, communications transmission, video and audio applications. The bundled solution eliminates separate testing of PHY and device controllers. This allows companies to focus valuable engineering resources on application and product design activities, saving both design time and budget.
The GUC USB 3.0 Device Controller IP supports SuperSpeed USB peripheral functions, providing information a transfer speeds 10 times faster than Hi-Speed USB. It is backwards compatible with USB 2.0 to ensure interoperability between existing USB products. The IP has passed the USB-IF SuperSpeed product testing procedures. GUC has been a USB-IF certified integrators in 2011.
The M31 Technology USB 3.0 transceiver IP provides a complete range of USB 3.0 host and peripheral applications. The USB 3.0 IP integrates high-¬speed mixed signal circuits to support SuperSpeed traffic at 5Gbps and is backward compatible with USB 2.0 and USB 1.1. The IP is optimized to provide minimal die area and low power consumption. M31 Technology USB 2.0 and USB 3.0 PHY are both USB-IF Certificated since 2012.
"We are glad to see this successful bundle solution. Combining both parties' strengths, the GUC/M31 USB 3.0 offers a fast and reliable path to market." said CJ Liang, Vice President of R&D at GUC.
"This announcement is the first in a series of high speed interface bundling collaborations," explained Meisie Jong, Vice President of Sales at M31 Technology Corporation.
"We share with GUC a mutual commitment to reduce design time and design costs through our bundle solution."
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