Before an investor conference, TSMC Chairman Morris Chang announced that TSMC’s 16nm manufacturing market share may fall behind its competitors in the short-term. However, he is confident that TSMC can snatch back its market share, and TSMC is actively developing more advanced manufacturing process for 10nm products.

Morris Chang, at the same time, also stated that in 2013 TSMC began developing 10nm technology. 10nm technology followed the 16 nm FinFET (Fin-type field effect transistor) and after 16 FinFET, it is the third-generation of manufacturing processes and the global leader in efficiency and density.

In order to fully develop 10nm manufacturing processes, Morris Chang will personally lead 400 research and development employees and has established the “Night-Hawk Plan” to facilitate a smooth launch for TSMC’s 10nm product lines, while also reducing learning curves for employees.

However, semiconductor equipment manufacturers have disclosed that under the control of equipment manufacturers, ASML and EUV, the rate of technology exports has not reached production requirements. TSMC 10nm will still use immersion machines to carry out multiple exposure modes and be used as equipment for core developers. They will also concentrate on production at 12-inch wafer plants.