TAIPEI, Taiwan — CoreTech System (Moldex3D) will exhibit the newest suite of simulation solutions for IC Packaging at SEMICON Taiwan 2014, which includes 2.5D to 3D IC stacking underfill process that can fulfill the needs of both designing and manufacturing fields.

“It ensures validation and optimization of a complex microchip encapsulation process, in which a proper runner and gate design is also included and verified,” said Venny Yang, President of CoreTech System.

Moldex3D IC Packaging analysis has enabled an interfae for users of Cadence EDA tool to further enhance the packaging design-to-manufacturing process. Furthermore, Moldex3D also has integrated with ANSYS andd ABAQUS.

Users are able to import Moldex3D's simulation results to these two systems for post-processing. With pioneering 3D dynamic flow visualization technology, potential defects such as wire sweep, paddle shift, voids, warpage, and residual stress relaxation can be predicted and well-addressed upfront prior to actual manufacturing.

SEMICON Taiwan 2014 is going to be held from September 3 to 5 at Nangang Exhibition Hall.