To cope with the customer demands, iST purchased the Thermal EMMI (InSb) for detecting defects of IC; Quantera II X-ray Photoelectron Spectroscopy (XPS, also known as ESCA – Electron Spectroscopy for Chemical Analysis), which are both officially available in this month.

iST observed, while process progresses towards 20nm, 16nm and less, manufacturers including semiconductor, LED, PCB and display panel are having urgent needs for using high resolution Dual-Beam FIB and XPS/ESCA to perform surface elements analysis for developing new materials and monitoring processes.

Therefore, iST has further escalated its capacity in material analysis facilities by upgrading its Dual-Beam FIB equipment to the highest level-- FEI Helios-600 and introducing Quantera II X-ray Photoelectron Spectroscopy (XPS, also known as ESCA – Electron Spectroscopy for Chemical Analysis), capable of analyzing samples with surface structures as fine as 7.5 um, a breakthrough to the conventional 50um limit.

The analysis is not affected by conductivity of sample; the device is capable of detecting the state, distribution and chemical bond of surface elements of the material.

Besides, expanding its Material Analysis equipment, for 3D packaged products in Failure Analysis, iST has introduced Thermal EMMI (InSb) for detecting defects without de-capsulation of IC.

Dr. Kim Hsu, the deputy director of Failure Analysis department of iST said, “our newly acquired Thermal EMMI helps you rapidly identify the defect is in which layer of the die by estimating the depth of defect in the 3D packaging (the z-axis direction).”

Dr. Kim Hsu further pointed out that, the great deal update and introduction of new equipment recently, not only can enrich the technique support and service project of iST, but also can solve more material analysis and failure analysis problem for customers in developing products.