“eASIC Nextreme-3 28nm device can provide higher performance, lower power to meet Huawei product requirements,” said Ronnie Vasishta, president and CEO of eASIC Corporation.

“Expansion to the higher throughput in transport network is inevitable and this requires innovative solutions that can only be addressed with custom silicon. We are excited to be shipping products to Huawei and to help them meet their aggressive performance, power and cost objectives, as FPGAs cannot any longer meet these critical requirements.”