Samsung Electronics announced that it has begun mass producing its latest smartphone memory solution, the LPDDR5 UFS-based multichip package (uMCP)...
Samsung Electronics today introduced the industry’s first 0.64-micrometer (μm)-pixel image sensor, the 50-megapixel (Mp) Samsung ISOCELL JN1...
Allegedly, TSMC’s major rivals Intel and Samsung have stepped into the 10nm foundry service. Samsung will put the 10nm into mass production in 2017. In response to the competition of advanced foundry service, Mark Liu said that the company will be manufacturing at the full capacity for 10nm production by the end of 2016.
“Our goal is to enable your production by the end of 2016,” Liu said at the event updating customers on the company’s plans.
TSMC said its move to 10nm combined with its earlier 16nm technology would put it ahead of its competition.
Meanwhile, TSMC will hold its first quarter’s investor conference on April 16, it is widely circulated that the company will reduce the year-over-year (YOY) growth rate of OEM wafer.
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