ASE CEO Wu said that the semiconductor industry will show tepid growth of about 0-5% this year, and the same to the next few years.

Outlooks this year, Wu said, ASE will focus on advanced packaging services, including systems integration technology, pillars flip-chip packaging, wafer level package plus outer lead and inner lead bond technology.

According to ASE, end of the fourth quarter last year, the revenues of system-in-package of the ASE Group accounted for about 18%, this year is forecasted of 30% of group revenue. Combined with system-level packaging and electronic manufacturing services business will be the main growth momentum of ASE.