Based on this platform, Leadcore is launching a 28nm SoC (System on a Chip) for smartphones and other fields of applications, including high-performance application processor and mobile baseband functions. The chip has passed validation and is ready for mass production.

SMIC is the first foundry to provide both 28nm PolySiON and 28nm HKMG processes in Mainland China. Compared with the traditional PolySiON process, SMIC's 28nm HKMG process can provide improved drive capability and transistor performance and substantially reduce gate leakage.

Based on SMIC's 28nm HKMG process platform, the Smartphone SoC launched by Leadcore has better performance, higher speed and lower power consumption, and CPU performance achieves 1.6GHz. To extend Leadcore's success in 4G mobile communication market, this launch will expand the market share of Smartphones which are equipped with chips made in China.

"We're glad to collaborate with Leadcore on 28nm HKMG process and develop advanced Smartphone SoC. Following the successful adoption by mainstream smartphones of the chips based on SMIC's 28nm PolySiON process, our 28nm HKMG process has also been highly recognized by end customers and is ready for commercial use," said Dr. Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC,

"We will continue to develop and improve 28nm derivative technology platforms and expect to introduce an enhanced compact version of 28nm HKMG process at the end of 2016, and provide more optimized processes to customers."

Qian Guoliang, General Manager of Leadcore said, "Leadcore is dedicated to the R&D and application of the core technologies of 3G/4G mobile connectivity terminal and collaboration with ecosystem partners to create world-class products. This powerful industrial alliance with SMIC will promote domestic chip technology development and help Leadcore to improve the cost performance of our products to better serve the markets of Smartphone, smart car and robot and support 'Made in China 2025.' In the future, we will further strengthen our cooperation with SMIC and develop high-performance chip products based on more advanced technology nodes."