Taipei, Friday, Dec 06, 2019, 04:18

News

TSMC to Publish 7nm FinFET Technology at ISSCC 2017

By Korbin Lan
Published: Nov 15,2016

TSMC wafer

TAIPEI, Taiwan – The International Solid-State Circuits Conference (ISSCC) 2017 is going to be held on February 5, 2017 to February 9 in San Francisco, United States. And there will be 15 papers to be published from Taiwan, including TSMC’s 7-nanometer Fin Field-Effect Transistor (FinFET) technology which will be the industry’s first to announce at ISSCC 2017.

More on This

MediaTek Reveals More Details About Dimensity 1000 5G SoC

TAIPEI, Taiwan - Three days after launching the Dimensity 1000 5G chip, MediaTek Inc. once again held a rare technical briefing on the chip...

MediaTek Announces World’s Most Advanced 5G Chipset Family, & Dimensity 1000 5G SoC

TAIPEI, Taiwan –MediaTek today unveiled Dimensity, MediaTek’s family of powerful 5G system-on-chips (SoCs) offering an unrivaled combination of connectivity...

At ISSCC 2017, a total of 208 papers were selected, and 15 papers of which came from Taiwan including nine papers from the industry and six papers form academia.

Five papers of TSMC was selected (including one from the TSMC USA), three of which are from memory circuit design department of TSMC, and the other two are analogical circuit papers.

In addition, TSMC will be the first to publish 7nm FinFET technology, and has verified it on the 256M bits high-density static random access memory test chip. It will greatly enhance the computing performance of processor of mobile phone, tablet and PC.

CTIMES loves to interact with the global technology related companies and individuals, you can deliver your products information or share industrial intelligence. Please email us to en@ctimes.com.tw

2614 viewed

comments powered by Disqus