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MegaChips Adopts Omni Design’s Ultra-Low Power A/D Converter IP for Next-Gen Communication Networks

Published: Dec 06,2016

MegaChips Corporation and Omni Design Technologies, a provider of high-performance, ultra-low power semiconductor IP cores, today announced a strategic partnership for the development of high-performance, low-power analog front end (AFE) chips.

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This partnership brings together two industry leaders with the joint purpose of offering differentiated solutions and products to enable next-generation home and access networks and industrial automation.

"Both MegaChips and Omni Design offer unique technology for the communications market," said Masahiro Konishi, general manager at MegaChips Corporation. "By partnering with Omni Design Technologies, an industry leader in semiconductor IP cores, we can continue to develop timely, original AFE chips designed to give our customers a competitive edge."

Dr. Kush Gulati, president and CEO of Omni Design Technologies, said: "MegaChips has an outstanding reputation for providing cutting-edge system solutions for its customers. We are delighted to partner with them to develop high-performance, ultra-low power AFEs incorporating high-resolution and high-speed Analog-to-Digital Converters (ADCs) based on our revolutionary SWIFT technology."

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