The ASE Group is the world's largest semiconductor packaging and testing manufacturer. ASE pointed out that AI, smart vehicles, and IoT will bring about additional opportunities for high-end system chip packaging, and the growth will be especially rapid in demand for high-end packaging such as semiconductor components with heterogeneous chip integration, system in package (SIP), and integrated fan type packaging.

Although ASE has already established factories in the China, Singapore, Malaysia, Mexico, United States, Japan, and South Korea regions, all of their high-end packaging and testing is located Taiwan, and their research and development center is also located in Kaohsiung.

(TR/ Phil Sweeney)