Taipei, Thursday, Aug 22, 2019, 00:50

News

TWS Bluetooth Headsets Market to Grow 52.9%, Says TrendForce

Published: Jun 03,2019

According to TrendForce 's latest report, the release of Bluetooth 5.0, which solved the problems of transmission and power consumption inherent in TWSs, along with the release of Apple's AirPods, gave rise to a speedily growing market. One by one, Samsung, Sony, Huawei, Xiaomi and other smartphone brands are also releasing TWS headsets in 2019, projected to bring TWS earbud shipments up to 78 million sets, registering a YoY growth of 52.9%.

More on This

Annual Decline for Feed-in Tariff Should be Set at 4% in Order to Meet 2025 PV Installation Goals

According to the latest “Solar Powering Taiwan: Special Report” by EnergyTrend, a division of TrendForce, Taiwan's P...

Edge AI to Aid Development of Smart Manufacturing and Push Market Scale to US$370 billion in 2022

Thanks to the ripened, new technology, manufacturers may deploy advanced sensing technology in conjunction with AI algor...

TrendForce points out that TWS headsets have become a hot topic in the market: besides possessing acoustic features, it also has a wide variety of function augmentations, placing it nearer smartphones and other consumer electronics compared to other earphone products in terms of product strategies. Not only that, but TWS shipment numbers also have the potential to move into the hundred millions, motivating Apple, Samsung, Sony, Huawei, Xiaomi and other brands to release products like there's no tomorrow. Apple's AirPods, in particular, form the majority of the market, boasting a towering market share of 51.3%.

Moreover, smartphone manufacturers have been developing voice assistants and other speech recognition applications in order to boost the added value of TWS headsets. This is especially the case under the considerations to boost response speeds in voice recognition: apart from augmented transmission functionalities, simple voice assistants will also be implemented into TWS headsets, allowing certain speech recognition and analysis loads to shift to these small devices and reducing data transmission loads and response time. This development trend will bring up the hardware capabilities of TWS headsets to another level. Therefore numbered alongside Bluetooth communication chips as key TWS components to upgrade in the future are computing chips, memories and even MEMS microphones.

Looking at the current supply and demand situation for components, if voice assistants are to be introduced into TWS headsets in the future, noise reduction and voice recognition are bound to become important functions. This will also increase the adoption of MEMS microphones, which will arrive to at least 4~6 per pair. As for key Bluetooth chip modules, apart from Apple, who develops and implements its own Bluetooth chips, most brands will use chips made by international giants Qualcomm, Broadcom and China supplier Bestechnic. Suppliers including Taiwan's Realtek , Airoha and Pixart will also be rolling out TWS Bluetooth chip modules, inviting adoption by various brands.

CTIMES loves to interact with the global technology related companies and individuals, you can deliver your products information or share industrial intelligence. Please email us to en@ctimes.com.tw

518 viewed

comments powered by Disqus