Indium8.9HF is specifically formulated to reduce voiding, while delivering high transfer efficiency with low variability. In addition to outstanding print transfer and excellent response-to-pause, this no-clean solder paste also provides excellent pin-in-paste solderability and hole-fill, while remaining stable at room temperature for up to 30 days.

Indium8.9HF is perfectly suited for a variety of applications, especially automotive, due to its unique oxidation barrier technology. This solder paste delivers robust reflow capability from a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes potential defects.

Indium8.9HF solder paste is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes.