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ADLINK Launches New IIoT Building Blocks Based on Latest Intel Atom, Pentium and Celeron CPU

Published: Nov 15,2016

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ADLINK Technology today announced new computer-on-modules and embedded boards based on the latest Intel Pentium N4200 and Intel Celeron N3350 processors (codename Apollo Lake) and Intel Atom processor E3900 series (codename Apollo Lake-I).

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These new offerings take advantage of several improvements over the previous generation of respective Intel processors, including improved graphics performance with support for Gen 9 LP (18x EUs) and 4K/UHD displays, added virtualization capabilities with full support for Intel VT-x/VT-d, high-speed DDR3L memory and eMMC 5.0 flash storage.

ADLINK has developed two new COM Express modules, the Compact Size cExpress-AL and Mini Size nanoX-AL. Both modules offer DDR3L memory up to 1867MHz, with the nanoX-AL supporting a soldered memory capacity range from 2GB to 8GB. In addition to providing three independent display ports that cover DDI/LVDS/optional analog VGA, the cExpress-AL fully utilizes the graphics capabilities enabled through the latest Intel Atom processor and still supports legacy applications. Both modules are cost efficient platforms with rich native I/O support that eliminate the need for an added USB hub, and provide long-life support of at least seven years.

ADLINK’s LEC-AL module is based on this year’s SMARC 2.0 specification update and offers dual-channel LVDS, 2x MIPI CSI camera interfaces and DDR3L memory up to 1867MHz. The company is also introducing the Q7-AL module based on the Qseven 2.1 specification with fast LPDDR4 memory. All new modules and boards target industrial automation, medical and infotainment applications that require compact, rugged forms factors for harsh, space constrained environments.

Finally, ADLINK’s thin Mini-ITX embedded board AmITX-AL-I offers a low profile design, dual DDR3L memory up to 1867MHz, and dual BIOS and Trusted Platform Module (TPM) support. Rich graphics interfaces and I/O includes HDMI, 2x DisplayPort, LVDS/eDP (optional), 7x USB, 6x COM port, dual GbE LAN, PCIe x1, mini-PCIe, 2x SATA 3 and mSATA.

All new modules and boards are equipped with ADLINK’s Smart Embedded Management Agent (SEMA) to provide access to detailed system activities at the device level, including temperature, voltage, power consumption and other key information, and allow operators to identify inefficiencies and malfunctions in real-time, thus preventing failures and minimizing downtime.

ADLINK's SEMA-equipped devices connect seamlessly to our SEMA Cloud solution to enable remote monitoring, autonomous status analysis, custom data collection, and initiation of appropriate actions. All collected data, including sensor measurements and management commands, are accessible any place, at any time via encrypted data connection.

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