Taipei, Thursday, May 28, 2024, 11:58

Technology Front

Murata's Surface Mount Type Y1 Class Safety Certified Capacitor

Published: May 15,2017

912 Read

Murata Manufacturing has launched a surface mount type IEC 60384-14 Y1 class safety certified ceramic capacitor for low-profile power supplies. This capacitor is ideal for all AC-DC switching power supplies where a low-profile is sought for compact AV equipment, LED illumination, or 1U rack mounted equipment. The mass production of the capacitor began in May 2017.

More on This

01005 Inch Size Multilayer Ceramic Capacitor with a Capacitance Value of 1.0μF from Murata

Murata Manufacturing has developed the world’s first multilayer ceramic capacitor with a capacitance value of 1.0μF in the 01005 inch size (0...

Murata Invests in MEMS Sensor Manufacturing in Finland

Murata is significantly increasing global production capacity, including most recently its factory located in Finland. A...

Safety certified capacitors are placed at a power line input side in order to eliminate noise that builds up primarily in commercial AC power lines.

Safety certified capacitors are usually of the lead type, but the mounted height above the board surface is a problem because it hinders efforts to make low-profile devices and it limits component layout. In addition, because lead type capacitors are through-hole mounted, the lead wires are exposed on the underside of the circuit board. A fixed amount of insulating distance between the exposed lead wires and the metal components of the device is required by safety standards, so this complicates spatial layout within a device.

The new Murata capacitor uses a structure of plate-shaped terminals on a disc-shaped ceramic dielectric placed within a plastic mold to reduce the terminal thickness that is present with lead type capacitors, and this results in a mounted height of 2.5mm or less for the product.

Furthermore, the component format enables reflow surface mount, and there is no longer a need to assure insulating distance at the underside of the board. This advances profile reduction for power supply devices subject to size limitations in compact AV equipment, LED illumination and 1U rack mounted equipment, for which spatial design has been difficult.

comments powered by Disqus