The device includes a fully integrated Thermopile AFE circuit, which includes an OPA, LDO, PGA and a 24-bit Delta Sigma A/D Converter. The 128 bytes of True EEPROM Memory can be automatically calibrated during production by software and the UART/SPI interfaces can be used for connecting to peripheral devices such as Bluetooth etc. Due to these internal features, the required number of external components is greatly reduced which will result in reduced manufacturing costs. As for system resources, the device includes 8K words of Flash Program Memory, 384 bytes of Data Memory and a Timer Module.

The device is supplied in both 48-pin and 64-pin LQFP package types. The hardware development tool is known as the e-Link which works together with an OCDS (On Chip Debug Support) architecture BH67V2752, which can provide users with rapid development and simulation to achieve a greatly reduced time to market.