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RECIF Technologies Presents R.PACK Software Suite

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Published: Jun 20,2025

 

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Trymax Semiconductor Equipment B.V. Reaches 500 Process Chamber Installations in Asia

Trymax Semiconductor Equipment (Trymax) announces the installation of its 500th process chamber in Asia. This milestone reflects continued momentum across key regional markets—including China, Taiwan, South Korea, Malaysia, and the Philippines—and signals strong progress toward the company’s goal of 1,000 global installations by the end of 2025...

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Accuron Technologies Acquires Majority Stake in Trymax Semiconductor

Accuron Technologies secures a controlling interest in Trymax Semiconductor Equipment (Trymax), a specialist in plasma-based and UV-based process equipment and solutions for semiconductor manufacturers. This transaction expands Accuron’s scope of solutions in the Semiconductor Equipment sector and strengthens its European presence...

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HOLTEK New HT32F61730/741 Li-Battery Management MCUs

Holtek announced the release of two new Li-Battery management MCUs, the HT32F61730 and HT32F61741. Compared with the second generation HT32F61630 and HT32F61641 devices, these new MCUs also have internal Li-battery voltage detection circuitry but now with an increased accuracy of ±15mV...

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SnapMagic and Harwin Partner to Help Engineers Design Faster

SnapMagic and Harwin have partnered to release over 3500 new computer-aided design (CAD) models that will help engineers design electronics faster. Engineers can spend weeks creating CAD models for their printed circuit board (PCB) designs in what is often a laborious and complex process...

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esmo group Launches Apollo Quad Handler to Revolutionize Semiconductor Testing

esmo group (esmo) announced the launch of its latest product—the Apollo Quad Handler. Designed to bridge the gap between the engineering and production phases, this advanced handler offers unprecedented flexibility, reliability, and energy efficiency for final test operations, setting a new standard for semiconductor testing...

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Kandou Launches World's First Small Form Factor PCIe Transport Layer Switch

Swiss high-speed interface technology provider Kandou recently unveiled the world's first small form factor PCIe Transport Layer Switch, Zetti, at the OCP Global Summit. Thomas Boudrot, VP of Sales and Business Development, spoke with CTIMES about the product's technical features and Kandou's outlook on the PCIe market...

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