
Social Gaming Market in the APAC Region to Expand at a CAGR of 10.12%
A recent market research report added to the collection of ResearchMoz.us forecasts the social gaming market in the APAC region to expand at a CAGR of 10.12% during the period between 2014 and 2019. Social gaming refers to the activity of playing virtual games on various networking websites, social media platforms, and social media apps...

AUO Reports Sep. Revenue and Shuffles Management
TAIPEI, Taiwan — AU Optronics Co. (AUO) on October 8 announced its unaudited consolidated revenue of NT$31.41 billion for September 2015, up by 3.0 percent from the previous month, and down by 11.8 percent compared to the same period in 2014...

Holtek’s HT45F56 8-bit Flash MCU Is a Qualified Product for Security
TAIPEI, Taiwan — Holtek Semiconductor Inc. held its 2015 new product seminar in Taipei on October 7, where lots of state-of-the-art applications were shown. Among which, the HT45F56 is specialized in security applications. For example, in vehicle security and kitchen safety...

Sony Acquires Softkinetic Systems S.A., to Advance Its Next-Gen Range Image Sensors
Sony Corporation is announcing that it has completed the acquisition of Softkinetic Systems S.A. ("Softkinetic"), after reaching an agreement with the company and its major shareholders. With this acquisition, Softkinetic - which possesses time-of-flight ("ToF") range image sensor technology, as well as related systems and software - has become a wholly-owned subsidiary of Sony...

HIWIN Exhibits Industry 4.0 Products at EMO Milano 2015
TAIPEI, Taiwan - Taiwan’s HIWIN Technologies Corp. at EMO Milano 2015 exhibited new Smart Ballscrews and a Linear Guideway, and shipments of this system package are expected to begin during the second half of next year. In addition, HIWIN also announced plans purchase European machine tool manufacturers...

Imec, Cadence Complete Tapeout of First 5nm Test Chip
Nano-electronics research center imec and Cadence Design Systems today announced that the companies completed the first tapeout of a 5nm test chip using extreme ultraviolet (EUV) as well as 193 immersion (193i) lithography. To produce this test chip, imec and Cadence optimized design rules, libraries and place-and-route technology to obtain optimal power, performance and area (PPA) scaling via Cadence Innovus Implementation System...