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Samsung Electronics Introduces Integrated Secure Element Solution for IoT Applications

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Published: Oct 19,2017

 

Axiomtek’s ICO120-83D - An Industrial IoT Gateway Enables Quickly Connect IoT Devices to the Cloud

Axiomtek has announced the upcoming availability of ICO120-83D, an industrial IoT gateway designed to simplify device-cloud connection and accelerate industrial internet of things development. It was specifically designed for smart energy and smart automation fields that need to collect and transfer data from large numbers of end devices...

Samsung Introduces New ARTIK Secure IoT Modules and Security Services

Samsung Electronics today announced ARTIK secure “s” systems-on-modules and services for the ARTIK IoT Platform to strengthen edge security. Samsung ARTIK IoT platform now delivers device-to-cloud security for companies to build, develop and manage secure, interoperable, and intelligent IoT products and services for everything from smart homes to high-tech factories...

STMicroelectronics' Advanced Automotive Processors with Built-In Security Set

STMicroelectronics announced its latest automotive processors that feature a dedicated, built-in security module. The new Telemaco3P telematics and connectivity processors (STA1385 and its variants) are the first automotive microprocessors to integrate a powerful, dedicated, isolated Hardware Security Module (HSM), which acts like an independent security guard to watch data exchanges and encrypt and authenticate messages...

Molex Introduces Pico-EZmate Slim 1.2mm Pitch Wire-to-Board Connection System

Molex introduces the Pico-EZmate Slim 1.2mm Pitch Wire-to-Board Connector, designed to provide reliable connection in a compact profile that improves both reliability and assembly speed. “As consumer electronics products get more compact, manufacturers are looking to reduce the overall device size while not sacrificing reliability or production flexibility,” said Rick Lee, global product manager, Molex...

40VIN, 2A Silent Switcher µModule Regulator in 6.25mm x 4mm BGA Package

Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTM8063, a 40VIN, 2A µModule step-down regulator in a tiny 6.25mm x 4mm BGA package. The package size is 75% smaller than the existing equivalent product...

BIOSTAR Launches Flagship RACING Z370GT7 for Intel’s 8th Gen Core Desktop CPUs

BIOSTAR introduces its flagship Intel Z370 motherboard under the third generation RACING series, the BIOSTAR RACING Z370GT7. This motherboard supports the latest 8th generation Intel Core processors also known as Coffee Lake. The RACING Z370GT7 sports premium features that gamers, overclockers, professional content creators, and modders demand...

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