Technology front
AAEON's FWS-2260 to Secure Small-scale Networks with New Gen CPU
By
Published: Apr 12,2016


ETX 3.0 Module to Extend Legacy Applications and Lifecycles
Portwell announces the release of the PEM-E205VLA, an ETX 3.02 (95mm x 114mm) computer-on-module based on the Vortex86DX3 processor. The PEM-E205VLA ETX module delivers optimized value and service levels by running multiple applications securely and reliably on virtualization-optimized platforms...

New Performance High Bay LED Lighting Technology
LG Electronics USA is introducing its new energy-efficient, round and IP65-rated LED high bay with wireless communications, designed for easy installation thanks to its advanced wireless grouping technology and light weight. Similar to LG's existing Simple Choice high bay lighting...

Industry’s Longest Reach 28Gbps Repeater ICs for Network Backplane and Front Panel Applications
Broadcom announced a new set of 8-channel 28Gbps repeater IC devices, the BCM82109 and BCM82181, designed for network backplane and front panel applications. The BCM82109 is an 8-channel unidirectional repeater device footprint-compatible to the Broadcom BCM82209 unidirectional retimer device...

SMD Schottky Barrier Rectifiers Save Space in Automotive
Vishay Intertechnology introduced six new surface-mount Schottky barrier rectifiers in the low-profile DO-219AB (SMF) package. Providing space-saving alternatives to SMA and SOD123W packages, the Vishay Semiconductors SS1FL3...

a 5V, High-Surge Transient Protection Array for Safeguarding Industrial Ethernet Links
Semtech announced the RClamp0534N, a versatile 4-line, low-cap transient protection array for safeguarding industrial interfaces against transient voltage threats. The RClamp0534N offers 25A (8x20µs waveform) of surge protection in a small 3...

Keysight's New Semiconductor Device Modeling and Characterization Software Tool Suite
Keysight announced the newest release of its industry-leading device modeling and characterization software suite: Integrated Circuits Characterization and Analysis Program (IC-CAP) 2016, Model Builder Program (MBP) 2016, and Model Quality Assurance (MQA) 2016...
Top Stories
Most Popular
- 1STM Reveals New Antenna-matching RF Integrated Passive Devices for STM32WL MCUs
- 2HOLTEK HT32 Series Conforms to the UL/IEC 60730-1 Class B Software Security Certification
- 3u-blox’s Newest Module Stands Temperatures up to 105 °C for Advanced Automotive Applications
- 4u-blox Introduces the Smallest LTE-M/NB-IoT Module with 23dBm RF Output Power
- 5Toshiba Launches 100V High-Current Photorelay for Industrial Equipment
- 6u-blox Extends Reach of Secure LTE-M, NB-IoT Module with 400MHz Support
- 7VIAVI First to Introduce RedCap Device Emulation, Boosting 5G IoT Commercialization
- 8DKSH Partners with Life Science Innovator Nicoya in Asia
- 9HOLTEK New BP66FW1242 Wireless Charger Rx MCU
- 10World’s Smallest Plug-and-play NFC Security Module