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First to Integrate Wi-Fi, Bluetooth Smart and NFC Into Single Development Kit Using WICED
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Published: Dec 05,2014
3D Perception Delivers Immersive Display System to Homeland Security Simulation Center
3D perception (3DP), announced the installation of its Northstar immersive visual display solution for ETC Simulation’s (“ETC”) incident command simulator at Concordia University’s new Homeland Security Simulation Center in Portland, Oregon, USA...
Smallest DLP Pico 1080p Chipset Enables FHD Projection From Compact Applications
Texas Instruments (TI) announced that the 0.47" TRP Full-HD 1080p chipset for video and data display applications is sampling to its third-party developer network. Based on the proven DLP Cinema technology used in more than eight out of ten digital theatres worldwide, the 0...
Tollgrade and Lantiq Offer Next Generation DSL Line Testing for All-IP Networks
Tollgrade Communications, Inc. and Lantiq announced that they have partnered to offer broadband carriers a best-in-class, seamless and standardized line testing solution for Next Generation Networks (NGN). The solution combines Lantiq’s MELT chipsets with Tollgrade’s LoopCare Operations Support System (OSS) software and allows telcos to migrate field proven and mature test expertise to the requirements of new all-IP networks...
HOLTEK New HT45F5Q Charger Flash MCU Features New Charger Management Module
With the charger product application area firmly in its sights, Holtek presently announces the release of its new A/D Flash MCU, the HT45F5Q. When compared with traditional MCU solutions for these applications, this new device has greatly enhanced MCU resources and the added feature of a new charger management module unit...
ARBOR Expands its Product Line with New Industrial Widescreen Panel PC
ARBOR Technology introduce the expansion of its series of industrial panel PC - ASLAN series, to complete its product line-up. The ASLAN series comes with 16:9 ratio widescreen which provides greater operation and viewing experience than traditional 4:3 displays, making it perfectly suitable for industry automation and field sites applications...
Ultrathin 1.8mm,3A µModule Regulator in LGA Package for PCIe, ATCA, microTCA Cards
Linear Technology introduces the LTM4623 3A µModule (micromodule) step-down regulator in an ultrathin 1.8mm profile LGA package with only a 6.25mm x 6.25mm footprint. With solder paste, the package height is less than 2mm, meeting the height restrictions of many PCIe (Peripheral Component Interconnect Express), Advanced Mezzanine Cards (AMC) for AdvancedTCA carrier cards in embedded computing systems...
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