New Intel C612 Series Server & Workstation Motherboards
Compact ones, humongous ones, long ones and some even with Thunderbolt ports. ASRock Rack has announced its new line of Intel C612 series servers and workstations for either enterprise customers or workstation customers. These systems support Intel’s latest Xeon E5-2600/1600 v3 (Haswell-EP) CPUs plus the next generation DDR4 memory modules for providing superior performance and efficiency...
Femtoamp Bias Current Op Amps Achieve 500MHz Gain Bandwidth for TIA & Buffer
Linear Technology announces the LTC6268 and LTC6269, FET-input single and dual op amps, which deliver outstanding performance for high speed and high dynamic range transimpedance amplifier (TIA) and buffer applications. With just 3fA bias current at 25°C and 4pA max over the entire –40°C to 125°C temperature range, the LTC6268/LTC6269 can resolve input currents from several femtoamps to amps...
New Hardware and Software for Brocade MLXe Routers
Brocade announced new hardware modules and software for the Brocade MLX Series routers with the capabilities to address the bandwidth, scale, and performance needed for the networks of today; providing a seamless path to open, software-driven programmable networks that the industry refers to as the "New IP"...
Enable Control of Existing Home Entertainment Products with Bluetooth Smart Remotes
CSR plc and Universal Electronics Inc. announce that CSR is collaborating with Universal Electronics Inc. (UEI) to add Infra-Red (IR) setup and control functionality to remote controls based on CSR µEnergy Bluetooth Smart platforms...
UXM Wireless Test Set Expands Functional Test Capabilities, Delivers Greater RF Design Confidence
Keysight Technologies, Inc. announced new functionality enhancements to the E7515A UXM wireless test set including support for LTE-A category 7 data throughput, expanded functional test capabilities, and in-depth RF performance verification using the industry standard X-Series measurement applications...
Broad IP Portfolio for New TSMC 16nm FinFET Plus Process
Cadence Design Systems, Inc. announced a broad portfolio of intellectual property (IP) for TSMC’s 16nm FinFET Plus (16FF+) process. The wide array of IP for the 16FF+ process enables systems and semiconductor companies to take advantage of the 15 percent speed improvement with same total power or 30 percent total power reduction at the same speed compared to the16FF process...
Top Stories
Most Popular
- 1STM Reveals New Antenna-matching RF Integrated Passive Devices for STM32WL MCUs
- 2HOLTEK HT32 Series Conforms to the UL/IEC 60730-1 Class B Software Security Certification
- 3u-blox’s Newest Module Stands Temperatures up to 105 °C for Advanced Automotive Applications
- 4u-blox Introduces the Smallest LTE-M/NB-IoT Module with 23dBm RF Output Power
- 5Toshiba Launches 100V High-Current Photorelay for Industrial Equipment
- 6u-blox Extends Reach of Secure LTE-M, NB-IoT Module with 400MHz Support
- 7VIAVI First to Introduce RedCap Device Emulation, Boosting 5G IoT Commercialization
- 8DKSH Partners with Life Science Innovator Nicoya in Asia
- 9HOLTEK New BP66FW1242 Wireless Charger Rx MCU
- 10World’s Smallest Plug-and-play NFC Security Module
Address: Rm. A204, No. 287-2, Sec. 3, Chengde Rd., Datong Dist., Taipei City , Taiwan (R.O.C.)
Phone:+886 2 2585-5526
E-Mail:en@ctimes.com.tw