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Published: Feb 27,2014
World’s First Five-in-One Combo Wireless Connectivity SOC for Mobile Devices
TAIWAN, Hsinchu –Mediatek announced MT6630, the world’s first five-in-one combo wireless system-on-a-chip (SOC) to support full featured smartphones, tablets and other premium mobile devices. The MT6630 dramatically reduces the component count and eBOM while improving ease-of-design for manufacturers by eliminating external low noise amplifiers (LNAs) and integrating the Wi-Fi 2...
First 5G WiFi 2x2 MIMO Combo Chip for Smartphones
Broadcom Corporation introduced the industry's first 5G WiFi (802.11ac) 2x2 Multiple Input Multiple Output (MIMO) system-on-a-chip (SoC) for smartphones. The Broadcom BCM4354 SoC will enable manufacturers to deliver twice the Wi-Fi performance of 1x1 MIMO devices used in smartphones today while improving system power efficiency up to 25 percent when using wireless applications...
Symtavision Launches SymTA/S 3.5 Featuring New Embedded Network
TAIPEI, Taiwan — Symtavision, the global leader for timing design and timing verification for embedded real-time systems, has launched SymTA/S 3.5, a major new version of its market-leading system-level tool suite for planning, optimizing and verifying embedded real-time systems...
Industry's Smallest IO-Link Ambient Light Sensor
Using the Santa Cruz ambient light sensor (ALS) from Maxim Integrated Products, Inc., factories can quickly configure and monitor multiple red, green, blue (RGB) and infrared (IR) ambient light sensors with the high accuracy required in industrial applications...
Cadence Announces New Tensilica Imaging and Video Processor
TAIPEI, TAIWAN — Cadence Design Systems, Inc., a leader in global electronic design innovation, introduced the Tensilica Imaging and Video Processor-Enhanced Performance (IVP-EP) core, the latest imaging and video dataplane processor in the IVP product line...
World’s First Commercial 64-bit Octa-Core Chipset with Integrated 5 Mode LTE
Qualcomm Incorporated today announced that has added the Qualcomm Snapdragon 610 and 615 chipsets to the Snapdragon 600 tier for high-end mobile computing devices. Both new chipsets integrate Qualcomm Technologies’ 3rd Generation LTE modem, supporting Category 4 data rates for new requirements such as LTE-Broadcast and LTE Dual SIM Dual Active (DSDA)...
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