HOLTEK New HT66F2050/HT66F2040 High Functional Integration Low Pin Count MCU
Holtek announces the release of its new high functionally integrated, low pin count Flash MCUs, the HT66F2050 and HT66F2040. The devices have a wide operating voltage range from 1.8V to 5.5V, a 1ms quick start function and small size QFN package types...
MicroSys Introduces World’s First System-on-Module with the NXP S32G274A Processor
MicroSys Electronics announces the world’s first System-on-Module (SoM) with NXP Semiconductors S32G274A processor. The miriac MPX-S32G274A SoM comes with quad Arm Cortex-A53 cores plus triple Arm Cortex-M7 dual-cores and combines ASIL D safety and hardware security with more than 10 times the real-time performance and networking throughput of NXP’s previous automotive gateway devices...
AAEON FWS-2365 Certified by FlexiWAN for SD-WAN Open Architecture Deployment
AAEON announces their partnership with flexiWAN, the leading pioneer in open source SD-WAN software. With this partnership, AAEON’s desktop uCPE white box solution, the FWS-2365 has received certification from flexiWAN, allowing customer and vendors to leverage a wider selection of network equipment for the implementation of third-party VNF applications...
STMicroelectronics Unveils Next-Gen MEMS Accelerometer for High-Performance Automotive Applications
The STMicroelectronics AIS2IH three-axis linear accelerometer brings enhanced resolution, temperature stability, and mechanical robustness to non-safety automotive applications including anti-theft, telematics, infotainment, tilt/inclination measurement, and vehicle navigation...
HOLTEK New BP45F4NB/BP45FH4NB Power Bank MCUs
Holtek announced the release of its new power bank dedicated Flash MCUs, the BP45F4NB and BP45FH4NB. Using their internal complementary PWM drive function, the devices can implement full charge and discharge battery management operations...
Bluetooth 5.1 Module Enables Mesh Networking for Massive IoT Applications
u-blox has specified Nordic’s nRF52833 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) to power its NINA-B4 stand-alone Bluetooth 5.1 modules. The small (10 by 15 by 2.2 mm) Bluetooth LE/Bluetooth 5.1 MCU modules with open CPU architecture are optimized for, and can be supplied preinstalled with, Wirepas Massive (previously Wirepas Mesh), a decentralized large-scale mesh networking solution...
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