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Global OSAT Market Shows Signs of Recovery in 2H19, But Yearly Revenue to Decline Slightly
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Published: Nov 20,2019
Keysight Technologies Unveils Industry 4.0-ready In-Circuit Test (ICT) Suite
Keysight Technologies today announced the i3070 Series 6 In-Circuit Test (ICT) suite of solutions which enables electronics manufacturers to improve test throughput and the operational efficiency of their printed circuit board assembly (PCBA) manufacturing...
Fingerprint Cards Unveils New Slim Side-mounted Capacitive Sensor for Mobile Devices
Fingerprint Cards today announces the launch of a new side-mounted capacitive touch sensor for biometric authentication. Responding to customer demand, the slim FPC1540 sensor enables a range of the latest smartphone designs including borderless and foldable phones...
Cree and STMicroelectronics Expand and Extend Existing Silicon Carbide Wafer Supply Agreement
Cree and STMicroelectronics announced today the expansion and extension of an existing multi-year, long-term silicon carbide (SiC) wafer supply agreement to more than $500 million. The extended agreement is a doubling in value of the original agreement for the supply of Cree’s advanced 150mm silicon carbide bare and epitaxial wafers to STMicroelectronics over the next several years...
Asia/Pacific Spending on Security Solutions Projected to Reach 16.4 Billion in 2019
According to the latest IDC Worldwide Semiannual Security Spending Guide, spending on security hardware, services, and software in Asia/Pacific is expected to reach USD 16.4 billion in 2019, an increase of 20.01% over previous year...
Chen Liang-gee Meets NVIDIA Chief Scientist William J. Dally to Deepen AI Cooperation
TAIPEI, Taiwan - Taiwan’s Ministry of Science and Technology (MOST) has teamed up with NVIDIA once again following NVIDIA's response to MOST’s AI research strategy, and after jointly proposing five major directions for cooperation, MOST invited NVIDIA Senior Vice President and Chief Scientist William J...
Faraday and UMC Collaborate to Launch a Complete Set of 22nm Fundamental IP
HSINCHU, Taiwan - Faraday Technology and United Microelectronics Corporation, today announced the availability of Faraday’s fundamental IP on UMC’s 22nm ultra-low-power (ULP) and ultra-low-leakage (ULL) processes. The silicon-proven 22ULP/ULL fundamental IP, including multi-Vt standard cell libraries, ECO libraries, IO libraries, PowerSlash kit, and memory compilers, offers significant power reduction for the next level of SoC design...
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