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u-blox Announces First Timing Solutions Based on L1 and L5 GNSS Signals

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Published: Mar 28,2021

Mitsubishi Electric to Launch 80x60 pixel Thermal Diode Infrared Sensor

Mitsubishi Electric Corporation announced that its Mitsubishi Electric Diode InfraRed (MelDIR) sensor lineup will introduce on July 1 a new thermal sensor featuring a wide field of view (FoV) and high 80x60 pixel resolution for applications including security, heating, ventilation and air conditioning (HVAC), people counting, smart buildings and thermal scanners...

Astera Labs Expands Focus to Deliver Purpose-Built Solutions Addressing Connectivity Bottlenecks

Astera Labs announces its expanded focus to address system-wide performance bottlenecks in data-centric applications. The new Aries Compute Express Link (CXL 2.0) Smart Retimer portfolio (PT5161LX, PT5081LX) for low-latency CXL...

New Autodesk Fusion 360 App from SnapEDA Makes PCB Part Libraries a Snap

SnapEDA is releasing the SnapEDA for Autodesk Fusion 360 app in collaboration with Autodesk. This new app integrates SnapEDA’s database directly within Fusion 360, enabling electronics engineers and designers to search and place millions of electronic component models - including symbols, footprints and 3D models - directly within the Fusion 360 environment...

Global IT Spending to Jump by $228B and hit $3.92T in 2021

The COVID-19 crisis forced companies and organizations across the globe to speed up the digitalization of their business, as remote working and distance learning became the new normal amid the ongoing lockdown. The surge in the use of digital solutions and services abated the pandemic’s negative effect on IT spending, which still dropped to just under $3...

Kioxia Establishing A New 6th-Gen 3D Flash Memory Factory

Kioxia Corporation held a groundbreaking ceremony for its state-of-the-art semiconductor fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan. The facility will be one of the most advanced manufacturing operations in the world, dedicated to production of its proprietary 3D flash memory BiCS FLASH...

PICMG Announces Official Ratification of COM-HPC Specification

PICMG announces that COM-HPC has been approved and ratified, and is now available for public download and distribution. "Twenty-six industry-leading companies worked together diligently and cohesively over a span of five years”, said Christian Eder, the COM-HPC Working Group Chair...

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