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Shortage Caused by Explosive Growth in Mini LED Demand to Result in 5-10% Price Hike for LED Chips
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Published: Jan 20,2021
MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC
HSINCHU, Taiwan – MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences. The addition of the 6nm Dimensity 1200 and 1100 chipsets to MediaTek’s 5G portfolio gives device makers a growing suite of options to design highly capable 5G smartphones with top of the line camera features, graphics, connectivity enhancements and more...
ST Partners with Schneider Electric on Carbon Neutrality and Energy-Efficient Solutions
TAIPEI, Taiwan – STMicroelectronics has selected Schneider Electric as a strategic partner to support its goal to reach carbon neutrality by 2027. Schneider Electric, the leader in the digital transformation of energy management and automation, will support ST in this next stage of its ongoing efforts to reduce its global environmental footprint...
u-blox SARA-R5 LTE-M Modules Distinguished as a CES Innovation Awards Honoree
u-blox has announced that its SARA-R5 LTE-M modules with IoT Security-as-a-Service have been distinguished as a CES 2021 Innovation Awards Honoree. The CES Innovation Awards program, owned and produced by the Consumer Technology Association (CTA), is an annual competition honoring outstanding design and engineering in consumer technology products across 28 product categories...
Taiwan Government Leading 100 Startups For CES2021
TAIPEI, Taiwan - In 2020, the global economy faced the impacts of the COVID-19 pandemic and the US-China trade war. While the economies around the world were critically affected, Taiwan was able to break through the predicament and make extraordinary performances in foreign trade and industry development...
TSMC to Kick off Mass Production of Intel CPUs in 2H21, Says TrendForce
TAIPEI, Taiwan - Intel has outsourced the production of about 15-20% of its non-CPU chips, with most of the wafer starts for these products assigned to TSMC and UMC, according to TrendForce’s latest investigations. While the company is planning to kick off mass production of Core i3 CPUs at TSMC’s 5nm node in 2H21, Intel’s mid-range and high-end CPUs are projected to enter mass production using TSMC’s 3nm node in 2H22...
Renesas Collaborates With Microsoft to Accelerate Connected Vehicle Development
Renesas Electronics announced its collaboration with Microsoft to accelerate the development of connected vehicles. Renesas’ R-Car Starter Kit, based on Renesas’ R-Car automotive system-on-chip (SoC), is now available as a development environment for the Microsoft Connected Vehicle Platform (MCVP)...