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More ICs Solutions

SEMICON Taiwan to Take Place During 13-15 September at Taipei’s Nangang Exhibition Center (2017.07.19)

TAIPEI, Taiwan – Semi announced today that SEMICON Taiwan (13-15 September), held at Taipei’s Nangang Exhibition Center, will feature over 1,700 booths and 700 exhibitors, and more than 45,000 attendees from the global electronics manufacturing supply chain...

Semiconductor Content in an Electronic System will reach 28.1% in 2017, Says IC Insights (2017.07.13)

IC Insights forecasts that the 2017 global electronic systems market will grow by only 2% to $1,493 billion while the worldwide semiconductor market is expected to surge by 15% this year to $419.1 billion. Moreover, IC Insights forecasts that the total semiconductor market will exceed $500...

China to Add Most of the 200mm Capacity Through 2021 with 34% Growth, Semi Report (2017.07.12)

SEMI issued an update to its 200mm Fab Outlook report, with improved and expanded report forecasting of 200mm fab trends out to 2021. SEMI’s analysts updated information on over 100 facilities, including the latest new facilities and investment projects in China...

GUC Opens New Korea Office (2017.07.11)

HSINCHU, Taiwan - Global Unichip Corp. (GUC) announced its facilities in Seoul, Korea. The company's new offices are located in AnnJay Tower at 3F, 208 Teheran-ro, Gangnam-gu, Seoul. GUC required new space to enhance both technical and business customer support...

Cellphone IC Sales Will Top Total Personal Computing in 2017 (2017.06.22)

The ongoing slump in shipments of standard personal computers along with the drop-off in tablets are setting the stage for cellphone IC sales to finally surpass integrated circuit revenues in total personal computing systems this year, based on new forecasts in the recently released update of IC Insights’ 2017 IC Market Drivers Report...

GUC Successfully Rolls out HBM2 Total Solution (2017.06.19)

HISNCHU, Taiwan – Global Unichip, the custom ASIC company, has successful taped out a 16nm, second-generation High Bandwidth Memory (HBM) PHY and controller with verified interposer design and CoWoS Package. The innovative ultra-high capacity memory ASIC solution will meet the demanding requirements of artificial intelligence (AI), deep learning (DL), and a variety of high performance computing (HPC) applications...

Imec Develops 200V/650V Dispersion Free Normally-off/e-mode Power Devices on 8-inch Si Wafers (2017.06.13)

Imec announced today that it has developed 200V and 650V normally-off/enhancement mode (e-mode) on 200mm/8-inch GaN-on-Silicon wafers, achieving a very low dynamic Ron dispersion (below 20 percent) and state-of-the-art performance and reproducibility...

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