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Samsung Completes Qualification of Its 2nd Generation 10nm Process Technology (2017.04.19)

Samsung Electronics announced today that its second generation 10-nanometer (nm) FinFET process technology, 10LPP (Low Power Plus), has been qualified and is ready for production. With further enhancement in 3D FinFET structure, 10LPP allows up to 10-percent higher performance or 15-percent lower power consumption compared to the first generation 10LPE (Low-Power Early) process with the same area scaling...

Foreign Fabs in China to Compel Country’s Domestic Foundries to Expedite Their 28nm Production (2017.04.10)

According to the global market intelligence firm TrendForce, Semiconductor Manufacturing International Corporation (SMIC) and Shanghai Huali Microelectronics Corporation (HMLC) are the two leaders among Chinese foundries in the development of the 28nm processing...

Combined Sales for Optoelectronics, Sensors and Actuators, Discrete ICs Increase 2% in 2016 (2017.04.06)

Combined sales for optoelectronics, sensors and actuators, and discrete semiconductors increased 2% in 2016 to reach a seventh consecutive record-high level of $67.9 billion, but growth rates in the three market segments were all over the map last year...

Global Semiconductor Materials Market Increases 2.4% in 2016 (2017.04.04)

SEMI announced that the global semiconductor materials market increased 2.4 percent in 2016 compared to 2015 while worldwide semiconductor revenues increased 1.1 percent. According to the SEMI Material Market Data Subscription, total wafer fabrication materials and packaging materials were $24...

U.S. Companies Still Hold Largest Share of Fabless Company IC Sales (2017.03.17)

According to IC Insights that fabless IC suppliers represented 30% of the world’s IC sales in 2016 (up from only 18% ten years earlier in 2006). As the name implies, fabless IC companies do not have an IC fabrication facility of their own...

UMC and Synopsys Collaboration Speeds 14-nm Custom Design (2017.03.15)

HSINCHU, Taiwan - United Microelectronics Corporation (UMC) and Synopsys today announced that the two companies have worked together to enable Synopsys Custom Compiler and Laker custom design tools to be used with UMC's 14-nanometer (nm) FinFET process...

Analog Bits Announces Mixed Signal Design Kits for 7nm at TSMC Technology Symposium (2017.03.14)

Analog Bits today announced availability of front-end design kits which enable use of low power IP on TSMC's latest 7nm process nodes. These design kits provide customers with early access to Analog Bits' latest low-power IP for SERDES, PLL, PVT sensors and POR - which are already shipping in other TSMC nodes such as 16FFC and 16FFP which will be demonstrated at the Symposium...

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