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NSTC Minister Meets with Czech Republic Minister of Science, Re-search and Innovation

瀏覽次數:1983

NSTC Minister Cheng-Wen Wu met with Czech Republic Science, Research and In-novation Minister Marek Zeni?ek in Prague to exchange views on future Taiwan-Czech scientific research cooperation. During this visit, which marked his first over-seas trip since taking office this May, Minister Wu participated in a semiconductor investment delegation led by Executive Yuan Secretary-General Ming-Hsin Kung. Minister Zeni?ek, who also took office this May, has been particularly supportive of working with Taiwan while promoting the Czech Republic’s scientific develop-ment and international research cooperation.

Minister Zeni?ek stated that the Czech Republic possesses strong R&D capabilities and has an advantage in terms of its unique geographic location. In addition to playing a key role in European semiconductors, Minister Zeni?ek expressed the hope that the Czech Republic could strengthen cooperation with Taiwan in sectors such as biotechnology, space, and AI.

Minister Wu also stated that Taiwan is more than willing to share its results in sci-entific development and industrial S&T applications with like-minded countries. To further promote academic research and talent training, Minister Wu said that fu-ture semiconductor cooperation with the Czech Republic will focus on the Ad-vanced Chip Design Research Center (ACDRC). Minister Wu also noted that Taiwan is currently investing in sovereign AI and specific AI development topics that in-clude space, biotechnology, and quantum.

In closing, Minister Wu stated that Taiwan looks forward to initiating scientific co-operation with the Czech Republic in a variety of fields. Both sides also discussed current talent shortages that both countries are facing, and expressed the hope that through policy promotion, more young people will enter fields related to sci-entific research.

超大規模資料中心重塑AI基礎設施
特別企劃半導體AI

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為了增加資料傳輸的速度、距離和效率,AI生態系統正在探索射頻(RF)矽中介層技術,以實現互補式金氧半導體(CMOS)、雙極互補式金氧半導體(BiCMOS)與三五族材料的異質整合。

為了增加資料傳輸的速度、距離和效率,AI生態系統正在探索射頻(RF)矽中介層技術,以實現互補式金氧半導體(CMOS)、雙極互補式金氧半導體(BiCMOS)與三五族材料的異質整合。